ASM International

Failure analysis of heat treated steel components.

This text on failure analysis focuses on steel failures arising during thermal processes such as forging, casting, heat treatment, welding, et cetera. It is intended to serve both as a reference source for use by designers, practicing metallurgists, mechanical and materials engineers, quality-control technicians, and heat treaters and as a textbook for advanced undergraduate and graduate courses on failure analysis or thermal processing of steel. The volume's 15 chapters address component design, overview of the mechanisms of failure in heat treated steel components, mechanisms and causes of failure in heat treated steel parts, general aspects of failure analysis, failure in steel forging, failures from the casting process, sources of failures in carburized and carbonitrided components, fatigue fracture of nitrided layers, steel heat treatment failures due to quenching, steel failures due to tempering and isothermal heat treatment, failure analysis in tool steels, case studies of steel components failures in aerospace applications, failure analysis of powder metal steel components, induction hardening, and failure analysis of steel welds. Eleven appendixes provide information on conversions, austenitizing temperatures, temper colors, physical properties of steels, and more. (Annotation ©2009 Book News Inc. Portland, OR)

Parametric analyses of high-temperature data for aluminum alloys.

The problem addressed here is that aluminum alloys change their properties under a combination of high temperature and time, but they cannot realistically be tested for an expected lifetime extending to decades at high temperature. A consultant with over half a century experience in the aluminum and materials information industries, Kaufman explains how time-temperature parametric equations can permit the folding of data obtained over a variety of temperatures and exposure times into a single relationship. Once that relationship is determined with adequate consistency and reliability, he says, it is possible to extrapolate the available data to anticipate service lives that substantially exceed the range of test data. He sets out three popular parameters, and discusses their theory and application. Then he presents data sets for various wrought and cast aluminum alloys. (Annotation ©2009 Book News Inc. Portland, OR)

Stainless steels for design engineers.

Seeking to bridge the gap between the current but raw information on the Internet, and the theory of scholarly books and journals, this book provides design engineers with a source of information at a level useful for both metallurgists and other engineers and technicians. The first section of the book covers elementary metallurgy, and the second section covers corrosion and oxidation. The third section is about each family of stainless steel alloys, including recent additions to the market. The fourth section is oriented toward processes important to users of stainless steel. The fifth section deals with major applications for stainless steel in areas such as architecture and construction, commercial and residential applications, marine systems, the petroleum industry, and the pulp-and-paper industry. Appendices on compositions, physical and mechanical properties of select alloys, and the software package Thermo-Calc are included. Information on the author is not given. (Annotation ©2009 Book News Inc. Portland, OR)

Testing and failure analysis; proceedings. (CD-ROM included)

This book/CD-ROM package presents material from a November 2008 symposium, in sections on emerging concepts, packaging and assembly level failure analysis (FA), FA processes, circuit edit, sample preparation, photon based techniques, scanned probe microscopy, system level FA, testing, nanoprobing, yield enhancement, and metrology. Some topics examined include characterization techniques for PCB pad cratering, thick film resistor failures, fast root cause analysis based on electrical defect localization, and scanning acoustic microscopy for solder joint failure analysis and design improvements. Other subjects covered are backside circuit edit on full-thickness silicon devices, embedded gold markers for improved TEM/STEM tomography reconstruction, and calibration of nanoprobe capacitance-voltage spectroscopy. There is no subject index. Information on the CD-ROM is not given. (Annotation ©2009 Book News Inc. Portland, OR)